UNIVERSITY PARK, Pa. — The Penn State-led Center for Heterogeneous Integration of Micro Electronic Systems (CHIMES) held its third annual review on Aug. 26-27 at University Park.
CHIMES was established in 2023 through support from the Semiconductor Research Corporation (SRC)’s Joint University Microelectronics Program 2.0 (JUMP 2.0), a consortium of industrial partners in cooperation with the Defense Advanced Research Projects Agency (DARPA).
The center’s team comprises students, post-doctoral researchers and principal investigators from 15 partner universities working to advance semiconductor technologies — essential components in electronic devices like phones, radar systems and computers.
The event welcomed over 140 attendees, bringing the CHIMES team together with industry liaisons and representatives from the SRC and DARPA to discuss the center’s research and next steps. Students displayed their research through lightning talks, 60 poster presentations and demos featuring software and hardware innovations.
The center’s principal investigators shared technical presentations and highlighted 13 potential disruptive technologies resulting from the center’s research.
“These breakthroughs could shape next-generation microelectronics, potentially reducing the energy consumption in data centers for AI applications, enabling advanced sensing, communication and more,” said Madhavan Swaminathan, CHIMES director and head of Penn State College of Engineering’s Department of Electrical Engineering. “As the U.S. invests heavily in domestic chip manufacturing, CHIMES is playing a central role in driving innovation and strengthening collaboration across academia and industry while preparing our student researchers to be future leaders in the field.”